There are a total of 1,549 bills of lading on file for IEC Techologies, S. De R.L. De C.V. between April 5th, 2017 and July 9th, 2026.
Of those 1,549 bills of lading, 1 were within the past 30 days and 1 were within the past 90 days.
| Total Records | 1,549 |
|---|---|
| Shipper Records | 0 |
| Consignee Records | 1,548 |
| Notify Party Records | 18 |
| First Shipment on File | Apr 5th, 2017 |
| Most Recent Shipment on File | Jul 9th, 2026 |
| Records in Last 30 Days | 1 |
| Records in Last 90 Days | 1 |
| Records in the Past Year | 64 |
Subscribe now for unlimited access to all manifests, vessels, shippers, consignees, and more for IEC TECHOLOGIES, S. DE R.L. DE C.V..
Below is a Sankey Diagram of the top 11 companies associated with IEC Techologies, S. De R.L. De C.V., and the top 4 companies associated with those associations.
Below are the top 11 companies associated with IEC Techologies, S. De R.L. De C.V. in terms of total bills of lading. Total Records are based on records since October 21st, 2012. Associations are based on records since July 2021.
| Company Name | Recent Shipment | Total Records | Associations |
|---|---|---|---|
| HP INC. | Jul 2026 | 97,783 | 1,206 |
| INVENTEC CHONGQING CO.,LTD | Jul 2026 | 2,730 | 191 |
| FULIAN PRECISION ELECTRONICS | Jul 2026 | 1,750 | 44 |
| INVENTEC CORPORATION | Jul 2026 | 3,589 | 39 |
| CLOUD NETWORK TECHNOLOGY SINGAPORE PTE LTD | Jul 2026 | 21,232 | 32 |
| May 2023 | 3 | 3 | |
| SQ TECHNOLOGY | Feb 2026 | 91 | 2 |
| IEC TECHNOLOGIES S. DE R.L. DE C.V. | Jul 2026 | 5,833 | 1 |
| HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD | Jan 2024 | 488 | 1 |
| Sep 2024 | 4 | 1 | |
| CHENBRO MICOM | Jul 2026 | 4,169 | 1 |
Below are other companies when arranged alphabetically. There is not neccessarily any association to IEC Techologies, S. De R.L. De C.V.
| Company Name | Recent Shipment | Total Records | Past 90 Days |
|---|---|---|---|
| IDX IMPRESSIONS VIRGINIA | Jul 2026 | 305 | 2 |
| IDX LOS ANGELES | Jul 2026 | 1,250 | 46 |
| IDX TORONTO | Jul 2026 | 122 | 1 |
| IDX VIRGINIA | Jun 2026 | 380 | 42 |
| IE, AAA LLC | Feb 2025 | 69 | 0 |
| IEA, LLC | Jul 2026 | 343 | 16 |
| IEC HOLDEN INC | Jun 2026 | 204 | 1 |
| IEC MOULD ENGINEERING MAKING LTD | Jun 2026 | 143 | 3 |
| IEC TECHNOLOGIES S. DE R.L. DE C.V. | Jul 2026 | 5,833 | 312 |
| IEC TECHOLOGIES, S. DE R.L. | Apr 2026 | 594 | 2 |
| IEDS LOGISTICS | Apr 2026 | 134 | 0 |
| IEE INTERNATIONAL ELECTRONICS & ENG | Sep 2025 | 253 | 0 |
| IEE LUXEMBOURG S.A. | Jun 2026 | 167 | 10 |
| IEE SENSING GDL SA DE CV | Jul 2026 | 673 | 9 |
| IEE SENSING SLOVAKIA S.R.O. | Jul 2026 | 1,067 | 24 |
| IEH AUTO PARTS LLC | Jul 2023 | 956 | 0 |
| IEI INTEGRATION CORP. | Jul 2026 | 303 | 6 |
| IEL FORWARDING SYSTEM INC. | Jun 2026 | 498 | 11 |
| IEL TECHNOLOGIE AGRICOLE | Jul 2026 | 97 | 14 |
| IEMCO GARMENTS | Jul 2026 | 146 | 2 |
| Run Date | Master BOL | House BOL | Voyage # | Bill Type | Carrier Code | IMO # | Vessel Name | Arrival Date | US Port | Foreign Port | Quantity | Weight | Type of Service | Shipper | Consignee | Notify Party | Commodity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2026-03-30 | CMDUSHZ7880664 | 0P501 | In-bond Automated | CMDU | 9450612 | CMA CGM LA SCALA | 2026-03-29 | LOS ANGELES, CALIFORNIA | YANTIAN CHINA (MAINLAND) | 616 CTN | 6,518 KG | Pier to Pier | HP INC. | IEC TECHOLOGIES, S. DE R.L. DE C.V. | INVENTEC PSG IEC TECHNOLOGIES O B | FRAME,KEYBOARD,PC+ABS TALC,US,P PART NO: H PO : INV: H | |
| 2026-03-25 | CMDUSHZ7900195 | 1TUH5 | In-bond Automated | CMDU | 9780859 | CMA CGM A. LINCOLN | 2026-03-24 | LOS ANGELES, CALIFORNIA | YANTIAN CHINA (MAINLAND) | 610 CTN | 8,492 KG | Pier to Pier | HP INC. | IEC TECHOLOGIES, S. DE R.L. DE C.V. | INVENTEC PSG IEC TECHNOLOGIES O B | SET,HOUSING,BOTTOM GASKET,PCB CPU,LZF-D/MF,CONDUCTIVE FFC,ACS,P,X.X.MM,./.MM,PET,S CABLE,ROUND+FFC,POS,MM,I,CAMERA,AC CABLE,ROUN... | |
| 2026-03-25 | CMDUSHZ7900197 | 1TUH5 | In-bond Automated | CMDU | 9780859 | CMA CGM A. LINCOLN | 2026-03-24 | LOS ANGELES, CALIFORNIA | YANTIAN CHINA (MAINLAND) | 408 CTN | 7,313 KG | Pier to Pier | HP INC. | IEC TECHOLOGIES, S. DE R.L. DE C.V. | INVENTEC PSG IEC TECHNOLOGIES O B | SET,HOUSING,BOTTOM CABLE,ROUND,POS,MM,I,EDP,NONTOUCH CABLE,ROUND,POS,MM,I,EDP,TOP,PRIVAC THERMAL MODULE,INTEL ARL U,UMA,W,CHI TH... | |
| 2026-03-25 | CMDUSHZ7895318 | 1TUH5 | In-bond Automated | CMDU | 9780859 | CMA CGM A. LINCOLN | 2026-03-24 | LOS ANGELES, CALIFORNIA | YANTIAN CHINA (MAINLAND) | 491 CTN | 6,873 KG | Pier to Pier | HP INC. | IEC TECHOLOGIES, S. DE R.L. DE C.V. | INVENTEC PSG IEC TECHNOLOGIES O B | SET,COVER,TOP,PCR SET,HOUSING,BOTTOM DIB,VGA ADAPTOR,HDMI SET,BEZEL RGB,DISPLAY,W SET,BEZEL RGB,DISPLAY,W SET,BEZEL,DISPLAY,,RGB... | |
| Run Date | 2026-03-30 |
|---|---|
| Estimated Arrival Date | 2026-03-29 |
| Actual Arrival Date | 2026-03-29 |
| Trade Update Date | 2026-03-23 |
| Master BOL # | CMDUSHZ7915569 |
|---|---|
| House BOL # | |
| Manifest Number | 000001 |
| Bill Type | In-bond Automated |
| Carrier Code | CMDU |
| Voyage # | 0P501 |
| IMO # | 9450612 |
| Vessel Name | CMA CGM LA SCALA |
| Vessel Country | MT |
| Place of Receipt | YANTIAN |
| Foreign Port of Lading | YANTIAN CHINA (MAINLAND) (57078) |
| Port of Unlading | LOS ANGELES, CALIFORNIA (2704) |
| Port of Destination | EL PASO, TEXAS (2402) |
| Foreign Port of Destination | |
| Weight | 9450 KG |
| Weight in KG | 9,450 KG |
| Quantity | 781 CTN |
| Volume | CM |
| Record Status | New Record |
| In-bond Entry Type | Immediate Transportation (IT) |
| Transportation Mode | Vessel, non-container |
| Container |
SEGU4019404 |
| Commodity Description |
PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,I/O,L,FR,HALOGEN FREE+ ROHS PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,I/O,L,FR,HALOGEN FREE+ ROHS PCB,BT MODULE,L,FR,HALOGEN FREE+ ROHS PCB,BT MODULE,L,FR,HALOGEN FREE+ ROHS PCB,TOUCH CTRL,L,HDI |
| Shipper Name | HP INC. C/O INVENTEC CHONGQING CO., |
|---|---|
| Address Line 1 | LTD. NO. 66 WEST DISTRICT 2ND RD |
| Address Line 2 | SHAPINGBA DISTRICT, CHONGQING |
| Address Line 3 | 401331 CHINA |
| COMM Number Qualifier | TE |
| COMM Number | LU.XIAN-JIE INVENTEC.COM |
| Consignee Name | IEC TECHOLOGIES, S. DE R.L. DE C.V. |
|---|---|
| Address Line 1 | BLVD. INDEPENDENCIA 10150 |
| Address Line 2 | CD. JUAREZ CHIH. MX. C.P. 32575 |
| Address Line 3 | JUAREZ CH 32575MEXICO |
| Notify Party Name | INVENTEC PSG IEC TECHNOLOGIES O/B |
|---|---|
| Address Line 1 | EXPEDITORS ELP PULLMAN 1 1450 |
| Address Line 2 | PULLMAN DRIVE SUITE 100 EL PASO |
| Address Line 3 | TX 79936 U.S.A. ATTN : PSG MAYRA |
| COMM Number Qualifier | TE |
| COMM Number | VALVERDE/MAYTE CARRILLO |
| Notify Party Name | SAMSUNG SDS AMERICA, INC. |
|---|---|
| Address Line 1 | 12631 E. IMPERIAL HIGHWAY, SUITE |
| Address Line 2 | F216, SANTA FE SPRINGS, CA 90670 |
| Address Line 3 | LA.OPERATION SAMSUNG.COM |
| COMM Number Qualifier | TE |
| COMM Number | JUN YEON KIM 714-497-6412 |
| Container Number | SEGU4019404 |
|---|---|
| Seal Number 1 | M9313109 |
| Seal Number 1 | M9313109 |
| Equipment Description Code | CN |
| Equipment Description | Container |
| Container Length | 40ft 0in (04000) |
| Container Height | 9ft 0in (00000900) |
| Container Width | 8ft 0in (00000800) |
| Container Type | 4500 |
| Load Status | Loaded |
| Type of Service | Pier to Pier |
| Cargo Description 1 | PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,I/O,L,FR,HALOGEN FREE+ ROHS PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,I/O,L,FR,HALOGEN FREE+ ROHS PCB,BT MODULE,L,FR,HALOGEN FREE+ ROHS PCB,BT MODULE,L,FR,HALOGEN FREE+ ROHS PCB,TOUCH CTRL,L,HDI |
| Additional Cargo 1 | PCB,MB,L,HDI,HALOGEN FREE+ ROHS PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,USB,L,FR,HALOGEN FREE+ ROHS PCB,ACS,L,.X.X.MM,FR,HALO PCB,ACS,L,FR,HALOGEN FREE+ ROHS PCB,TOPSUP,L,FR,HALOGEN FREE+ ROHS PCB,TRANS,L,FR,HALOGEN FREE+ ROHS PCB,SC,L,.X.X.MM,FR,HALOGEN FR |
| Additional Cargo 2 | PCB,ECOM,L,.XX.MM,FR,HALOGEN FRE PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,USB,L,FR,HALOGEN FREE+ ROHS PCB,ACS,L,.X.X.MM,FR,HALO PCB,ACS,L,FR,HALOGEN FREE+ ROHS PCB,TOPSUP,L,FR,HALOGEN FREE+ ROHS PCB,TRANS,L,FR,HALOGEN FREE+ ROHS KEYBOARD,,PVCY BL,P,BLACK,USA,. |
| Additional Cargo 3 | SPEAKER.W/HOUSING,OHM,W,X,.X. SPEAKER.W/HOUSING,OHM,W,X,.X. KEYBOARD,,PVCY BL,P,BLACK,USA,. GASKET,SHIELDING,LZF-D/MP,ADHESIVE PAD,MM,MM,MM,FSL-BSNA KEYBOARD,,TOUCHPAD BUTTON,.X., SPEAKER.W/HOUSING,OHM,W,X,.X SPEAKER.W/HOUSING,OHM,W,X,.X. |
| Additional Cargo 4 | SPEAKER.W/HOUSING,OHM,W,X,.X. PAD,THERMAL,MM,MM,.MM,DENKA FSL- PAD,THERMAL,TP,GRAPHITE,K=W/MK, FRAME,KEYBOARD,PC+ABS TALC,US,P SPEAKER.W/HOUSING,OHM,.W,X,.X SPEAKER.W/HOUSING,OHM,W,X,.X. SPEAKER.W/HOUSING,OHM,W,X,.X. FAN,BLOWER, .MM,V,CCW,PWM,WIRE, |
| Additional Cargo 5 | THERMAL MODULE,INTEL ARL,UMA,W,CHIPSET DIODE,ESD,.V,SMD,SLPPXJ,TR IC,SYNC STEP-DOWN REGULATOR,QFN-,P,T IC,SYNC STEP-DOWN REGULATOR,. .V,. IC,LED DRIVER,. .V,IC,SON,P,TR CONNECTOR,FPC,BACK FLIP,./.MM,FL,. CAPACITOR-CHIP,UF,V,M,XR,,TR,. RESISTOR-CHIP,.,+/- ,/W,,TR,+ |
| Additional Cargo 6 | RESISTOR-CHIP,.K,+/- ,/W,,TAP RESISTOR-CHIP,.K,+/- ,/W,,TAP RESISTOR-CHIP,.K,+/- ,/W,,TAP RESISTOR-CHIP,K,+/- ,/W,,TAP RES-CHIP-.K- -/W--TAP RESISTOR-CHIP,.,+/- ,/W,,TR INDUCTOR,.UH, ,KHZ,A,.XXM BEAD,OHM, ,A,.OHM,INCH, |
| Additional Cargo 7 | INDUCTOR,.UH,+- ,KHZ,A,X.X INDUCTOR,UH,+/- ,MHZ,MA,.X.X INDUCTOR,.UH, ,KHZ,.A,.X.X INDUCTOR,.UH, ,KHZ,.A,XX.M BEAD,OHM, ,MA,.OHM,MM,M IC,SEQUENCE CONTROLLER, .V,QFN,P,TR IC,BUFFER,ONE N INV,X-DFN-,P,TR IC,ANALOG MUX/DEMUX,X- DFN-,P,TR |
| Additional Cargo 8 | RES-CHIP-- -/W--TAP IC,USB TYPE-C PORT PROTECTOR,. .V,ES CAPACITOR-CHIP,UF,V,K,XR,,TR,. CAPACITOR-CHIP,UF,V,M,XR,,TR,. CAPACITOR-CHIP,UF,.V,M,XR,,TR CAPACITOR-CHIP,UF,V,M,XR,,TR CAPACITOR-CHIP,UF,V,K,XR,,TR,. CAPACITOR-CHIP,.UF,V,K,XR,,TR |
| Additional Cargo 9 | CAPACITOR-CHIP,.UF,V,K,XR,,TR CAPACITOR-CHIP,UF,V,K,XR,,TR CAPACITOR-CHIP,UF,.V,M,XR,,TR, CAPACITOR-CHIP,UF,V,K,XR,,TR CAPACITOR-CHIP,UF,V,M,XR,,TR CAPACITOR-CHIP,.UF,V,K,XR,,TR CAPACITOR-CHIP,.UF,.V,K,XR,,TR, CAPACITOR-CHIP,.UF,.V,K,XR,,TR |
| Additional Cargo 10 | IC,LED DRIVER,. .V,IC,SON,P,TR CONNECTOR,FPC,BACK FLIP,./.MM,FL,. CONNECTOR,USB. GEN ,TYPE A,-./. SOCKET,PCIEX KEY B NGFF,P,.MM,GOLD, CAP-CHIP--K,V-XR--TAP CAPACITOR-CHIP,PF,V,D,NP,,TR,. CAPACITOR-CHIP,.UF,V,K,XR,,TR, CAPACITOR-CHIP,UF,V,K,XR,,TR,. |
| Additional Cargo 11 | CAPACITOR-CHIP,.UF,.V,M,XR,,TR CAPACITOR-CHIP,UF,V,K,XR,,TR,. CAPACITOR-CHIP,.UF,V,K,XR,,TR CAPACITOR-CHIP,UF,V,M,XR,,TR,. CAPACITOR-CHIP,UF,V,M,XR,,TR,. RESISTOR-CHIP,.,+/- ,/W,,TR,+ RESISTOR-CHIP,,+/- ,/W,,TR,+/- RESISTOR-CHIP,K, ,/W,,TR |
| Additional Cargo 12 | RESISTOR-CHIP,M, ,/W,,TR RESISTOR-CHIP,.K,+/- ,/W,,TAP RESISTOR-CHIP,.,+/- ,/W,,TR RESISTOR-CHIP,.K, ,/W,,TAP RESISTOR-CHIP,.K,+/- ,/W,,TAP RESISTOR-CHIP,K,+/- ,/W,,TAP BEAD,OHM, ,A,.OHM,INCH, INDUCTOR,.UH,+- ,KHZ,A,.X. |
| Additional Cargo 13 | INDUCTOR,.UH,+- ,MHZ,A,.X.X INDUCTOR,.UH, ,KHZ,.A,XX.M IC,SYNC STEP-DOWN REGULATOR,. .V,. RES-CHIP-- -/W--TAP CAPACITOR-CHIP,UF,V,K,XR,,TR,. CAPACITOR-CHIP,UF,V,M,XR,,TR,. CAPACITOR-CHIP,UF,V,K,XR,,TR,. CAPACITOR-CHIP,.UF,V,K,XR,,TR, |
| Additional Cargo 14 | CAPACITOR-CHIP,UF,.V,M,XR,,TR, CAPACITOR-CHIP,UF,V,K,XR,,TR CAPACITOR-CHIP,UF,V,M,XR,,TR CAPACITOR-CHIP,.UF,V,K,XR,,TR CAPACITOR-CHIP,.UF,V,K,XR,,TR CAPACITOR-CHIP,.UF,V,K,XR,,TR CAPACITOR-CHIP,PF,V,J,CG,,TR CAPACITOR-CHIP,PF,V,K,XR,,TR |
| Additional Cargo 15 | CAPACITOR-CHIP,PF,V, ,CG,,TR, CAPACITOR-CHIP,.UF,V,K,XS,,TR, DUMMY,SMART CARD,TOP,PC+ABS+ TALC,W HOLDER,TOP,IO L,PC+ABS TALC,P BUTTON,TOP,FINGER PRINTS,PCFRE DUMMY,SIM,PC+ABS+ TALC,METEOR SILVER, THERMAL MODULE,INTEL ARL H,UMA,W,CHI TRAY,NANO SIM,RAL T,GLACIER SILVER |
| Additional Cargo 16 | SHIELD,CAN DDR,WWAN,SUS ,W THERMAL MODULE,INTEL ARL,DIS,W,.W,C THERMAL MODULE,INTEL ARL,DIS,W,.W,C PCB,SC,L,.X.X.MM,FR,HALOGEN FR PCB,ECOM,L,.XX.MM,FR,HALOGEN FRE PCB,LAN,L,FR,HALOGEN FREE+ ROHS PCB,MB,L,FR,HALOGEN FREE+ ROHS PCB,ACS,L,FR,HALOGEN FREE+ ROHS |
| Additional Cargo 17 | PCB,ACS,L,.X.X.MM,FR,HALOGEN F PCB,USB,L,FR,HALOGEN FREE+ ROHS PCB,BOT,L,FR,HALOGEN FREE+ ROHS PCB,TOP,L,FR,HALOGEN FREE+ ROHS ASSEMBLY,TOP,THICK,KEYBOARD,SUB,AI+ NON PART NO: H H H H H H H H H H |
| Additional Cargo 18 | H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H |
| Additional Cargo 19 | H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H |
| Additional Cargo 20 | H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H |
| Additional Cargo 21 | H H H H H H H H H H PO : |
| Additional Cargo 22 | |
| Additional Cargo 23 | |
| Additional Cargo 24 | |
| Additional Cargo 25 | INV: H H H H |
| Additional Cargo 26 | H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H |
| Additional Cargo 27 | H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H |
| Additional Cargo 28 | H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H |
| Additional Cargo 29 | H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H |
| Additional Cargo 30 | H H H H H H H H HS CODE: CARTONS INTO PALLETS |
| Additional Cargo 31 | HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION |
| Additional Cargo 32 | ARRANGEMENT. NOTIFY: HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ()- |
| Additional Cargo 33 | TEL : - () - /-- ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F, SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM -- |
| Marks and Numbers 1 | N/M |
| Port of Unlading | Total Records | Recent Shipment |
|---|---|---|
| Los Angeles, California | 1,078 | 2026-07-10 |
| Long Beach, California | 461 | 2026-01-05 |
| Houston, Texas | 10 | 2023-07-14 |
| Port of Lading | Total Records | Recent Shipment |
|---|---|---|
| Yantian China (Mainland) | 729 | 2026-07-10 |
| Shanghai China (Mainland) | 331 | 2025-09-05 |
| Yangshan China (Mainland) | 208 | 2025-07-09 |
| Ningbo China (Mainland) | 118 | 2024-06-14 |
| Pusan South Korea | 44 | 2025-02-22 |
| Xingang China (Mainland) | 34 | 2024-04-27 |
| Xiamen China (Mainland) | 26 | 2024-08-20 |
| Shilong China (Taiwan) | 24 | 2024-12-23 |
| Taibei China (Taiwan) | 23 | 2025-07-10 |
| Kaohsiung China (Taiwan) | 5 | 2024-12-13 |
Below are the top 10 company names and addresses for IEC Techologies, S. De R.L. De C.V. that were combined to create this record. While we try to make sure everything is as accurate as possible we can't guarantee complete accuracy for all records so please notify us of any errors.
| Company Name | Address | Last Record | Records |
|---|---|---|---|
| IEC TECHOLOGIES, S. DE R.L. DE C.V. | BLVD. INDEPENDENCIA 10150 CD. JUAREZ CHIH. MX. C.P. 32575 JUAREZ CH 32575MEXICO | 2025-09-05 | 519 |
| IEC TECHOLOGIES, S. DE R.L. DE C.V. | BLVD. INDEPENDENCIA 10150 CD. JUAREZ CHIH. MX. C.P. 32575 JUAREZ CH MEXICO | 2026-03-25 | 70 |
| IEC TECHOLOGIES, S. DE R.L. DE C.V. | 2026-03-30 | 32 | |
| IEC TECHOLOGIES, S. DE R.L. DE C.V. | 2025-07-09 | 565 | |
| IEC TECHOLOGIES, S. DE R.L. DE C.V. | 2024-07-16 | 209 | |
| IEC TECHOLOGIES, S. DE R.L. DE C.V. | 2024-10-03 | 43 | |
| IEC TECHOLOGIES, S. DE R.L. DE C.V. | 2025-02-22 | 38 | |
| IEC TECHOLOGIES, S. DE R.L. DE C.V. | 2024-12-23 | 31 | |
| IEC TECHOLOGIES, S. DE R.L. DE C.V. | 2024-10-28 | 22 | |
| IEC TECHOLOGIES, S. DE R.L. DE C.V. | 2025-05-05 | 5 |
| Phone Number | Last Appeared | Records |
|---|---|---|
| No phone number on file | ||
| Email Address | Last Appeared | Records |
|---|---|---|
| No email address on file | ||